Dummy components CGA (Column Grid Array)
The posts will absorb the stress caused by the difference in the coefficient of expansion between the ceramic substrates of the CCGA (the module) and the FR4 (Polyimide) of the PCB. CCGA type packages are more reliable than BGA type packages. CCGA packages can withstand stress, shock and harsh environments.
DAISY CHAIN SOLUTION
The daisy chain is used to detect the occurrence of faults in CCGA packages. Under normal operating conditions, daisy chain circuits have a low resistance measured at test points on the PCB. After technically testing the PCB, the board is subjected to harsh conditions such as vibration and temperature cycling, an open circuit (or large change in resistance), will target failures. These failures are usually caused by poor soldering or a broken post.
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COLUMN ATTACHMENT TOOLS
TopLine produces column attachment tools, so you can attach the columns to the boxes on your production floor.
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WELDING OF COLUMNS
TopLine produces a wide variety of welding rods to suit a wide range of applications, including the original Pb80/Sn20 version with a copper jacket and smooth rods in Pb90/Sn10. TopLine also offers a new type of column that has a low thermal resistance for better heat dissipation. We also have pre-tinned Pb90/Sn10 columns for better wetting.
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HELICAL MICRO-SPRINGS
TopLine manufactures a new type of interconnect that was invented by NASA engineers for applications that require long-term survivability. The micro helical springs have been tested in a lab to absorb shocks of 50,000G. NASA has granted an exclusive license to TopLine under U.S. Patent Application Serial No. 13/800,692 entitled "Interconnect Device and Assemblies".
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PIN-PACK TM
Pre-loaded cassettes with soldered posts allow for quick attachment. The Pin-Pack TM stud matrix matches the pitch of your case. Simply remove the adhesive strip and the posts will gently position themselves in the post attachment tool, without vibration or gaps. The empty 'Pin-Pack' can be used as a stand to protect the CCGA case during storage or transport. Patent pending.
FOR ANY ORDER OR ADDITIONAL INFORMATION, PLEASE CONTACT COMMERCIAL@ATOO-ELECTRONICS.COM